Motorola Droid 3 Disassembled

Electronista has decided to disassemble the Motorola Droid 3 launched via Verizon. And I have to say they found many interesting facts… First of all, we see the Droid 3 is one of the most difficult repairable smartphones. You may not believe but the CDMA iPhone 4 and the Droid 3 use the same the same Qualcomm MDM6600. Unlike its competitor, Motorola’s one uses the chip fully and can work on both GSM and HSPA 3G.

Of course, these handsets are rather different, and the fact they use the same chip doesn’t mean anything. For example, the Motorola Droid 3 is packed with a 1GHz dual-core TI OMAP 4430 processor. One more thing, Motorola uses SanDisk instead of Toshiba or Samsung for its built-in flash memory.

The battery is easy to remove, as there aren’t many traps, but the phone is full of security screws making it difficult to dislocate any part. Many parts are joined via a single ribbon cable, which means the users have to replace several components instead of a single one. One of the most vulnerable parts is the LCD, which is too difficult to remove, so there will be problems with repairing it.

So I guess you must be careful with your handset, because it is not easy to repair.

 

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Tags: breakdown, CDMA iPhone 4, GSM, HSPA 3G, Motorola Droid 3, Qualcomm MDM6600, TI OMAP 4430 processor

Category: News